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    Please use this identifier to cite or link to this item: https://ir.lib.ksu.edu.tw/handle/987654321/9638


    Title: Dressing Behaviors of PCD Conditioners on CMP Polishing Pads
    Authors: M. Y. Tsai
    J. C. Sung
    J. D. Peng
    L. W. Yan
    Contributor: 圖書資訊館
    Keywords: Chemical Mechanical Polishing
    Diamond Conditioner
    Polyurethane Pad
    Date: 2008-11-08
    Issue Date: 2010-04-12 14:41:02 (UTC+8)
    Abstract: Diamond pad conditioner or dresser can determine
    the efficiency of chemical mechanical polishing (CMP)
    processes and the quality of polished wafers.
    Conventional diamond pad conditioners are made by
    adhering discrete diamond grits on a flat substrate. The
    size distribution of diamond grits coupled with the
    deformation of the substrate often make the tips of
    diamond grits lying at different heights. Instead of
    attaching individual diamond grits to a metal substrate,
    a revolutionary design of pad conditioners is based on
    carving a structure out of sintered polycrystalline
    diamond (PCD) matrix. The PCD dresser is
    manufactured by wire electro discharge machining
    (WEDM) to form cutting pyramids of a specific size
    with a designed shape. The dressing characteri stics of
    pad surface textures are studied by comparison with
    conventional diamond pad conditioner. Experimental
    results indicate that the PCD dresser can dress asperities
    of the pad more uniformly than the conventional
    diamond dresser due to PCD dresser having identically
    shaped tip and the same height diamond . In addition the
    cutting rate of PCD dresser for IC1000 pad not only is
    reduced by about 30% and also it can dress pad more
    effectively than conventional diamond dresser.
    Appears in Collections:[機械工程系所] SME 2008第六屆全國精密製造研討會-國際製造工程學會中華民國分會

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