Kun Shan University Institutional Repository:Item 987654321/8329
English  |  正體中文  |  简体中文  |  全文笔数/总笔数 : 26833/27429 (98%)
造访人次 : 14779460      在线人数 : 250
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
搜寻范围 查询小技巧:
  • 您可在西文检索词汇前后加上"双引号",以获取较精准的检索结果
  • 若欲以作者姓名搜寻,建议至进阶搜寻限定作者字段,可获得较完整数据
  • 进阶搜寻


    jsp.display-item.identifier=請使用永久網址來引用或連結此文件: http://ir.lib.ksu.edu.tw/handle/987654321/8329


    题名: NUMERICAL STUDY OF THE DLC FILM FLOW FIELD ON THE ECR-PECVD REACTION CHAMBER
    作者: C. H. Tai
    F. L. Lih
    J.C. Leong
    W. C. Feng
    Y. S. Li
    关键词: DLC
    ECR-PECVD
    CFD
    deposition rate
    uniformity
    日期: 2008-11-08
    上传时间: 2010-01-28 10:31:36 (UTC+8)
    摘要: This paper mainly investigates the optimum parameters for the fabrication of uniform Diamond-like Carbon (DLC) film on the electron cyclotron resonance plasma enhanced chemical vapor deposition (ECR-PECVD) by analyzing the effect of the reacting gas velocity on the film properties. In order to ensure that the film capability both in protecting the lens module of infrared detection system but not interfering the system normal operation, this work makes use of computational fluid dynamics (CFD) approach to evaluate the uniformity, the deposition rate, and the conversion efficiency of the film at the substrate.
    In order to provide further understanding of adjusting the parameters involved in the fabrication process, this work has constructed the modeling of surface chemical reactions, flow and temperature fields, as well as heat and mass transfer phenomena. Simulation has shown that, under the combined influence of nature convection effect and mass transfer effect on the reactor, the flow field within the reactor recirculating flow and therefore affects the distribution of material deposition. In other words, the results of attach the endplate at the top of the substrate, the deposition rate of the substrate will available enhanced. However, the surface uniformity of the substrate is obviously less. Moreover, if the length of endplate is between 0.045m~0.085m, the uniformity of surface can be better, but when the length of endplate is too long, it will create uniformity of poor addition. In addition, both of opening gap and increase the diameter of the hole on the baffle, although the film can effectively improve the uniformity of surface, but not conducive to deposition rate.
    显示于类别:[機械工程系所] SME 2008第六屆全國精密製造研討會-國際製造工程學會中華民國分會

    文件中的档案:

    档案 描述 大小格式浏览次数
    A04-07本文.pdf363KbAdobe PDF49检视/开启


    在KSUIR中所有的数据项都受到原著作权保护.


    本網站之所有圖文內容授權為崑山科技大學圖書資訊館所有,請勿任意轉載或擷取使用。
    ©Kun Shan University Library and Information Center
    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - 回馈