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    Please use this identifier to cite or link to this item: http://ir.lib.ksu.edu.tw/handle/987654321/6471


    Title: 純金屬薄膜間接觸熱阻之研究
    The studies of the thermal contact resistance between the pure metal films
    Authors: 周煥銘
    張育斌
    陳家寬
    王國興
    林智偉
    謝幸幟
    杜政昀
    賴信良
    Keywords: 接觸熱阻
    金屬薄膜
    連續荷重
    單一荷重
    Thermal contact resistance
    Metal film
    continuous loading
    single loading
    Date: 2006-07-31
    Issue Date: 2009-12-30 14:30:03 (UTC+8)
    Abstract: 本論文採用自行設計之接觸熱阻試驗機,研究關於金屬對金屬薄膜之接觸熱阻,使用銅基材之錫鍍層與銅配對的情況下研究金屬薄膜間熱傳導之現象。並且,分別採用連續荷重及單一荷重之操作條件進行熱傳實驗,根據熱傳導係數值及接觸熱阻值的數據及試片表面SEM照片等實驗結果,研究金屬及薄膜間接觸熱阻之特性。發現所測得之接觸熱阻數據會在兩種基礎材料之間,且會因為荷重增加而接觸熱阻值則隨著下降。
    In this study, the thermal contact resistance between metal thin films are investigated. The metal pair - Cu/Sn-film/Cu/Sn-film/Cu is used to conduct the experiment. Moreover, the experiments for heat conduction were conducted by both of the continuous loading and the single loading. Furthermore, according to the heat-conduction coefficients, the thermal contact resistance values, and the SEM images obtained from the metal surfaces, the thermal contact resistances between the thin metal films can be investigated. The values of thermal contact resistance are in the range of the two basic materials. Furthermore, the values of thermal contact resistance decrease with increasing the interface peressure.
    Appears in Collections:[機械工程系所] 研究計畫

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