As the demand for downsizing in microelectronics is increasing, devicesrequire material with lower dielectric constant accordingly. The dielectric constantsfor most polyimide (PI), including polyetherimide (PEI), films are ~3.5. In this study,we modified the PEI by incorporating various monomers (fluorinated dianhydride6FDA and phenylene ether diamines) to reduce the dielectric constant. The dielectricconstants of synthesized PEIs decreased with increasing amounts of 6FDA contentand phenylene ether units. The Tg decreased gradually with PEI containing longerphenylene ether units, but increased with the content of 6FDA. The thermal decompositiontemperatures at 10% weight loss were ~550 ℃, indicating that thesePEIs have high thermal stability. Both the tensile strength and the modulus decreasedwith the PEI containing longer phenylene ether units. The PEI synthesized with 40%6FDA dianhydride and 1,4-bis(4-aminophenoxy)benzene (pBAB) diamine has thelowest dielectric constant of 2.78 at 1 MHz.