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    Please use this identifier to cite or link to this item: https://ir.lib.ksu.edu.tw/handle/987654321/3444


    Title: Preparation of Polyetherimide Nanocomposites with Improved Thermal, Mechanical and Dielectric Properties
    Authors: ChenBor-Kuan (陳伯寬)
    SuChia-Teh
    TsengMin-Chia
    TsaySun-Yuan
    Date: 2006-07-24
    Issue Date: 2009-08-14 23:42:06 (UTC+8)
    Abstract: Thermoplastic polyetherimide (PEI)-SiO2 nanocomposites were prepared from asoluble PEI, which was synthesized from m-phenylenediamine and bisphenol Adianhydride, in combination with tetraethoxysilane solution via a novel sol-gelprocess. A coupling agent was used to enhance the compatibility between PEI andsilica. This approach was compared with PEI-clay nanocomposite in whichmontmorillonite was modified with ammonium salts of 12-aminododecanoic acidusing an intercalation polymerization. The size and dispersion of the silica or clay inthe PEI nanocomposites were analyzed by x-ray diffractometer and scanning electronmicroscopy. It was found that the sol-gel process offered a fine interconnected or cocontinuousphase, whereas the clay remained dispersed in nanocomposites. Thoughthe thermal properties of PEI-clay nanocomposites were improved over pristine PEI,physical testing showed that the films become brittle as the organoclay contentincreased to over 2%. The thermal stability and mechanical properties of the PEI/silicananocomposites prepared by sol-gel process were improved with silica content up to10%. The onset decomposition temperatures were 550-600°C. The dielectric constantdecreased with increasing amounts of silica. At higher silica contents, the mechanicalproperties were reduced as a result of the phase separation.
    Relation: Polymer Bulletin, v. 57, 2006, p. 671-681
    Appears in Collections:[材料工程系所] 期刊論文

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