Preparation of Polyetherimide Nanocomposites with Improved Thermal, Mechanical and Dielectric Properties

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Title:	Preparation of Polyetherimide Nanocomposites with Improved Thermal, Mechanical and Dielectric Properties
Authors:	ChenBor-Kuan (陳伯寬) SuChia-Teh TsengMin-Chia TsaySun-Yuan
Date:	2006-07-24
Issue Date:	2009-08-14 23:42:06 (UTC+8)
Abstract:	Thermoplastic polyetherimide (PEI)-SiO2 nanocomposites were prepared from asoluble PEI, which was synthesized from m-phenylenediamine and bisphenol Adianhydride, in combination with tetraethoxysilane solution via a novel sol-gelprocess. A coupling agent was used to enhance the compatibility between PEI andsilica. This approach was compared with PEI-clay nanocomposite in whichmontmorillonite was modified with ammonium salts of 12-aminododecanoic acidusing an intercalation polymerization. The size and dispersion of the silica or clay inthe PEI nanocomposites were analyzed by x-ray diffractometer and scanning electronmicroscopy. It was found that the sol-gel process offered a fine interconnected or cocontinuousphase, whereas the clay remained dispersed in nanocomposites. Thoughthe thermal properties of PEI-clay nanocomposites were improved over pristine PEI,physical testing showed that the films become brittle as the organoclay contentincreased to over 2%. The thermal stability and mechanical properties of the PEI/silicananocomposites prepared by sol-gel process were improved with silica content up to10%. The onset decomposition temperatures were 550-600°C. The dielectric constantdecreased with increasing amounts of silica. At higher silica contents, the mechanicalproperties were reduced as a result of the phase separation.
Relation:	Polymer Bulletin, v. 57, 2006, p. 671-681
Appears in Collections:	[材料工程系所] 期刊論文

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