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    Please use this identifier to cite or link to this item: http://ir.lib.ksu.edu.tw/handle/987654321/10767

    Title: Effect of thermal annealing on nanoimprinted Cu–Ni alloys using molecular dynamics simulation
    Authors: Te-Hua Fang
    Cheng-Da Wu
    Win-Jin Chang(張文進)
    Sung-Shui Chi
    Contributors: 圖書資訊館
    Keywords: Thermal annealing
    Molecular dynamics
    Residual stres
    Date: 2009
    Issue Date: 2010-09-06 11:44:59 (UTC+8)
    Abstract: The mechanical behaviors of nanoimprinted Cu–Ni alloys before and after annealing were studied using
    molecular dynamics simulation with a tight-binding potential. The results showed that when the punch
    is advancing, the punching force obtained from the simulation with a tight-binding potential is lower
    than with the Morse potential. During and after withdrawing the punch from the specimen, the adhesive
    phenomena are observed and the large residual stress in the Cu–Ni alloys is induced. During the
    annealing process, the internal energy of Cu–Ni alloys decreased with increasing the temperature and
    the component of Cu. In addition, comparing the maximum residual stress in the Cu–Ni alloys with and
    without annealing treatment, the stress is significantly released after annealing, especially in the higher
    component of Ni.
    Appears in Collections:[機械工程系所] 期刊論文

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