English  |  正體中文  |  简体中文  |  Items with full text/Total items : 25271/25866 (98%)
Visitors : 5352150      Online Users : 76
RC Version 7.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version


    Please use this identifier to cite or link to this item: http://ir.lib.ksu.edu.tw/handle/987654321/10767


    Title: Effect of thermal annealing on nanoimprinted Cu–Ni alloys using molecular dynamics simulation
    Authors: Te-Hua Fang
    Cheng-Da Wu
    Win-Jin Chang(張文進)
    Sung-Shui Chi
    Contributor: 圖書資訊館
    Keywords: Thermal annealing
    Nanoimprint
    Molecular dynamics
    Residual stres
    Date: 2009
    Issue Date: 2010-09-06 11:44:59 (UTC+8)
    Abstract: The mechanical behaviors of nanoimprinted Cu–Ni alloys before and after annealing were studied using
    molecular dynamics simulation with a tight-binding potential. The results showed that when the punch
    is advancing, the punching force obtained from the simulation with a tight-binding potential is lower
    than with the Morse potential. During and after withdrawing the punch from the specimen, the adhesive
    phenomena are observed and the large residual stress in the Cu–Ni alloys is induced. During the
    annealing process, the internal energy of Cu–Ni alloys decreased with increasing the temperature and
    the component of Cu. In addition, comparing the maximum residual stress in the Cu–Ni alloys with and
    without annealing treatment, the stress is significantly released after annealing, especially in the higher
    component of Ni.
    Appears in Collections:[機械工程系所] 期刊論文

    Files in This Item:

    File Description SizeFormat
    張文進_2009(ASS-1).pdf1656KbAdobe PDF619View/Open


    All items in KSUIR are protected by copyright, with all rights reserved.


    本網站之所有圖文內容授權為崑山科技大學圖書資訊館所有,請勿任意轉載或擷取使用。
    ©Kun Shan University Library and Information Center
    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - Feedback